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Legacy Electronics Offers First 2GB High-Spped Memory Module

Available For 1U Chassis Server Group Design Applications With 1.2

SAN CLEMENTE, CA — July 24, 2002 — Legacy Electronics announces the first 2GB PC2100 Registered DDR Dual Inline Memory Module (DIMM) that meets a 1.2" PCB height requirement and incorporates the Canopy® 3-D subassembly technology, which facilitates heat dissipation and impedance control. The new DIMM is a Dual Data Rate (DDR) Synchronous Dynamic Random Access Memory (SDRAM), registered 184-pin, error correcting code(ECC) module, and the first to offer 2GB density at this PCB height. The 2GB module is built using lower-cost, standard, 66-pin TSOPs (thin, small outline packages).

"Engineering a module of this density and speed while keeping it manufacturable was a challenge; the Canopy® technology facilitated the manufacturability,"  says Ken Kledzik, Chief Technology Officer. "Plus, we don't compromise the quality of our designs; we support decoupling capacitors for both upper and lower SDRAMs, using three TVSOP registers (some manufacturers only use one or two) and a PLL clock buffer."

Also available in 512MB and 1GB densities, the JEDEC-standard DIMM uses a 2.5V power supply and offers ECC (error detection and correction).

Availability

The 2GB, 1.2" SDRAM DIMM is available with a 1-2 week lead time, with price discounts for volume quantities. A downloadable, four-page data sheet is available at www.legacyelectronics.com/files/8AL6MDAC-1xDG.pdf, or designers may call toll-free 888-466-3853, or e-mail techsupport@legacyelectronics.com.

About Legacy Electronics

Founded in 1993 and located among South Orange County, California's new high technology companies, Legacy Electronics is an ISO 9001-registered electronics firm. Three years ago the company purchased and moved into new manufacturing headquarters to accommodate expansion of surface-mount technology (SMT) and automated test (ATE) equipment, as well as the hiring of additional personnel.

*Legacy Electronics' Canopy® technology is a patented, 3-dimensional printed circuit board subassembly process using a single-sided reflow, which increases on-board memory capacity without pre-stacking components. Considered an alternative to traditional stacking technologies, Canopy® reduces memory module manufacturing costs while reducing time to market and reliability issues, including thermal failures.

Editor's note: a downloadable jpg e-photo of Legacy Electronics' new 1.2" height, 2GB DDR DIMM is available from http://www.legacyelectronics.com/images/8AS6MDLC-1JDG.jpg

For more details, contact press@legacyelectronics.com

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